Large Language Models for 3D IC Space Planning

Fuente: arXiv
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Auteurs principaux: Chu, Hung-Ying, Chen, Guan-Wei, Wei, Shao-Yu, Lin, Yu-Cheng
Format: Preprint
Publié: 2025
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_version_ 1866911179164614656
author Chu, Hung-Ying
Chen, Guan-Wei
Wei, Shao-Yu
Lin, Yu-Cheng
author_facet Chu, Hung-Ying
Chen, Guan-Wei
Wei, Shao-Yu
Lin, Yu-Cheng
contents Three-dimensional integrated circuits (3D ICs) have emerged as a promising solution to the scaling limits of two-dimensional designs, offering higher integration density, shorter interconnects, and improved performance. As design complexity increases, effective space planning becomes essential to reduce dead space and ensure layout quality. This study investigates the use of large language models (LLMs) for 3D IC space planning through a post-order slicing tree representation, which guarantees legal space plans while aiming to minimize dead space. Open-source LLMs were fine-tuned on large-scale synthetic datasets and further evaluated on MCNC-derived 3D benchmarks. Experimental results indicate that the proposed framework achieves a favorable balance between runtime efficiency, legality, and dead-space reduction, with zero-dead-space layouts obtained in a significant portion of test cases under practical runtime budgets. Beyond synthetic benchmarks, the method generalizes to MCNC cases such as ami33 and ami49, though larger and irregular instances remain challenging. The approach also shows potential for cross-domain applications, including logistics and 3D object placement, where spatial efficiency is critical. Overall, the results suggest that LLM-based space planning can serve as a data-driven complement to traditional electronic design automation (EDA) methods, providing new insights for scalable 3D layout generation.
format Preprint
id arxiv_https___arxiv_org_abs_2509_22716
institution arXiv
publishDate 2025
record_format arxiv
spellingShingle Large Language Models for 3D IC Space Planning
Chu, Hung-Ying
Chen, Guan-Wei
Wei, Shao-Yu
Lin, Yu-Cheng
Robotics
Three-dimensional integrated circuits (3D ICs) have emerged as a promising solution to the scaling limits of two-dimensional designs, offering higher integration density, shorter interconnects, and improved performance. As design complexity increases, effective space planning becomes essential to reduce dead space and ensure layout quality. This study investigates the use of large language models (LLMs) for 3D IC space planning through a post-order slicing tree representation, which guarantees legal space plans while aiming to minimize dead space. Open-source LLMs were fine-tuned on large-scale synthetic datasets and further evaluated on MCNC-derived 3D benchmarks. Experimental results indicate that the proposed framework achieves a favorable balance between runtime efficiency, legality, and dead-space reduction, with zero-dead-space layouts obtained in a significant portion of test cases under practical runtime budgets. Beyond synthetic benchmarks, the method generalizes to MCNC cases such as ami33 and ami49, though larger and irregular instances remain challenging. The approach also shows potential for cross-domain applications, including logistics and 3D object placement, where spatial efficiency is critical. Overall, the results suggest that LLM-based space planning can serve as a data-driven complement to traditional electronic design automation (EDA) methods, providing new insights for scalable 3D layout generation.
title Large Language Models for 3D IC Space Planning
topic Robotics
url https://arxiv.org/abs/2509.22716