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On-Package Memory with Universal Chiplet Interconnect Express (UCIe): A Low Power, High Bandwidth, Low Latency and Low Cost Approach

Fuente: arXiv

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Bibliographic Details
Main Authors:	Sharma, Debendra Das, Choudhary, Swadesh, Onufryk, Peter, Pelt, Rob
Format:	Preprint
Published:	2025
Subjects:	Hardware Architecture Distributed, Parallel, and Cluster Computing
Online Access:	Acceder al recurso
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