Development of 3D Pixel Sensors via an 8-inch CMOS-Compatible Process

Documenti analoghi

• Design and Characterization of Racetrack 3D-Trench Silicon Sensor Based on 8-Inch Process with Excellent Time Resolution
  di: Ji, Huimin, et al.
  Pubblicazione: (2026)
• Design, fabrication and initial test of a novel 3D-Trench sensor utilizing 8-inch CMOS compatible technology
  di: Liu, Manwen, et al.
  Pubblicazione: (2024)
• Development of a Neutron Imager using CMOS Pixelated Sensor
  di: Kamiya, Yoshio, et al.
  Pubblicazione: (2025)
• In beam performances of the MIMOSIS-2.1 CMOS Monolithic Active Pixel Sensor
  di: Deveaux, M., et al.
  Pubblicazione: (2025)
• Development of Small-pitch, Ultra-thin 3D Silicon Sensors at USTC
  di: Ma, Kuo, et al.
  Pubblicazione: (2026)