Thermal Analysis of 3D GPU-Memory Architectures with Boron Nitride Interposer
Fuente:
arXiv
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| Autori principali: | , , |
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| Natura: | Preprint |
| Pubblicazione: |
2025
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| _version_ | 1866908589596082176 |
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| author | Wang, Eric Han Yan, Weijia Huang, Ruihong |
| author_facet | Wang, Eric Han Yan, Weijia Huang, Ruihong |
| contents | As artificial intelligence (AI) chips become more powerful, the thermal management capabilities of conventional silicon (Si) substrates become insufficient for 3D-stacked designs. This work integrates electrically insulative and thermally conductive hexagonal boron nitride (h-BN) interposers into AI chips for effective thermal management. Using COMSOL Multiphysics, the effects of High-Bandwidth Memory (HBM) distributions and thermal interface material configurations on heat dissipation and hotspot mitigation were studied. A 20 °C reduction in hot spots was achieved using h-BN interposers compared to Si interposers. Such an improvement could reduce AI chips' power leakage by 22% and significantly enhance their thermal performance. |
| format | Preprint |
| id |
arxiv_https___arxiv_org_abs_2510_11461 |
| institution | arXiv |
| publishDate | 2025 |
| record_format | arxiv |
| spellingShingle | Thermal Analysis of 3D GPU-Memory Architectures with Boron Nitride Interposer Wang, Eric Han Yan, Weijia Huang, Ruihong Signal Processing As artificial intelligence (AI) chips become more powerful, the thermal management capabilities of conventional silicon (Si) substrates become insufficient for 3D-stacked designs. This work integrates electrically insulative and thermally conductive hexagonal boron nitride (h-BN) interposers into AI chips for effective thermal management. Using COMSOL Multiphysics, the effects of High-Bandwidth Memory (HBM) distributions and thermal interface material configurations on heat dissipation and hotspot mitigation were studied. A 20 °C reduction in hot spots was achieved using h-BN interposers compared to Si interposers. Such an improvement could reduce AI chips' power leakage by 22% and significantly enhance their thermal performance. |
| title | Thermal Analysis of 3D GPU-Memory Architectures with Boron Nitride Interposer |
| topic | Signal Processing |
| url | https://arxiv.org/abs/2510.11461 |