Characterization of heat transfer in 3D CMOS structures using Sideband Scanning Thermal Wave Microscopy

Fuente: arXiv

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Bibliographic Details
Main Authors:	Fonck, Valentin, Razeghi, Mohammadali, Spièce, Jean, Dobson, Phillip, Weaver, Jonathan, Ridgard, George, Noah, Grayson M., Gehring, Pascal
Format:	Preprint
Published:	2025
Subjects:	Other Condensed Matter
Online Access:	Acceder al recurso
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Internet

https://arxiv.org/abs/2510.27529