Chen, Z., & Gupta, P. (2025). YAP+: Pad-Layout-Aware Yield Modeling and Simulation for Hybrid Bonding.
Style de citation Chicago (17e éd.)Chen, Zhichao, et Puneet Gupta. YAP+: Pad-Layout-Aware Yield Modeling and Simulation for Hybrid Bonding. 2025.
Style de citation MLA (9e éd.)Chen, Zhichao, et Puneet Gupta. YAP+: Pad-Layout-Aware Yield Modeling and Simulation for Hybrid Bonding. 2025.
Attention : ces citations peuvent ne pas être correctes à 100%.