A coupled finite element-virtual element method for thermomechanical analysis of electronic packaging structures

Fuente: arXiv

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Bibliographic Details
Main Authors:	Gong, Yanpeng, Li, Sishuai, Mei, Yue, Xu, Bingbing, Qin, Fei, Zhuang, Xiaoying, Rabczuk, Timon
Format:	Preprint
Published:	2025
Subjects:	Numerical Analysis Computational Engineering, Finance, and Science
Online Access:	Acceder al recurso
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Internet

https://arxiv.org/abs/2511.09348