A coupled finite element-virtual element method for thermomechanical analysis of electronic packaging structures
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arXiv
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| Hauptverfasser: | , , , , , , |
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| Format: | Preprint |
| Veröffentlicht: |
2025
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| _version_ | 1866908761058181120 |
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| author | Gong, Yanpeng Li, Sishuai Mei, Yue Xu, Bingbing Qin, Fei Zhuang, Xiaoying Rabczuk, Timon |
| author_facet | Gong, Yanpeng Li, Sishuai Mei, Yue Xu, Bingbing Qin, Fei Zhuang, Xiaoying Rabczuk, Timon |
| contents | This study presents a finite element and virtual element (FE-VE) coupled method for thermomechanical analysis in electronic packaging structures. The approach partitions computational domains strategically, employing FEM for regular geometries to maximize computational efficiency and VEM for complex shapes to enhance geometric flexibility. Interface compatibility is maintained through coincident nodal correspondence, ensuring solution continuity across domain boundaries while reducing meshing complexity and computational overhead. Validation through electronic packaging applications demonstrates reasonable agreement with reference solutions and acceptable convergence characteristics across varying mesh densities. The method effectively captures thermal distributions and stress concentrations in multi-material systems, establishing a practical computational framework for electronic packaging analysis involving complex geometries. Source codes are available at https://github.com/yanpeng-gong/FeVeCoupled-ElectronicPackaging. |
| format | Preprint |
| id |
arxiv_https___arxiv_org_abs_2511_09348 |
| institution | arXiv |
| publishDate | 2025 |
| record_format | arxiv |
| spellingShingle | A coupled finite element-virtual element method for thermomechanical analysis of electronic packaging structures Gong, Yanpeng Li, Sishuai Mei, Yue Xu, Bingbing Qin, Fei Zhuang, Xiaoying Rabczuk, Timon Numerical Analysis Computational Engineering, Finance, and Science This study presents a finite element and virtual element (FE-VE) coupled method for thermomechanical analysis in electronic packaging structures. The approach partitions computational domains strategically, employing FEM for regular geometries to maximize computational efficiency and VEM for complex shapes to enhance geometric flexibility. Interface compatibility is maintained through coincident nodal correspondence, ensuring solution continuity across domain boundaries while reducing meshing complexity and computational overhead. Validation through electronic packaging applications demonstrates reasonable agreement with reference solutions and acceptable convergence characteristics across varying mesh densities. The method effectively captures thermal distributions and stress concentrations in multi-material systems, establishing a practical computational framework for electronic packaging analysis involving complex geometries. Source codes are available at https://github.com/yanpeng-gong/FeVeCoupled-ElectronicPackaging. |
| title | A coupled finite element-virtual element method for thermomechanical analysis of electronic packaging structures |
| topic | Numerical Analysis Computational Engineering, Finance, and Science |
| url | https://arxiv.org/abs/2511.09348 |