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| Main Authors: | , , |
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| Format: | Preprint |
| Published: |
2025
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| Subjects: | |
| Online Access: | https://arxiv.org/abs/2511.09960 |
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Table of Contents:
- Nanostructured materials, critical for thermal management in semiconductor devices, exhibit a strong size dependence in thermal transport. Studying thermal resistance variation across grain boundaries is critical for designing effective thermal interface materials. Frequency-domain Thermoreflectance (FDTR)-based techniques can provide thermal resistance mapping at the micrometer (μm) scale. Scanning Thermal Microscopy (SThM) enables quantification of local thermal transport with significantly higher spatial resolution (<100 nm). However, challenges in quantifying the raw signal to thermal conductivity and surface sensitivity limit its widespread adoption for understanding nanoscale heat transport and defect-mediated thermal properties in nanostructured films. Here, we introduce a circuit-based probe thermal resistance (R_p) calibration technique independent of parasitic heat pathways, enabling accurate determination of probe heat dissipation and tip temperature rise, thereby allowing extraction of local thermal resistance. SThM achieved sub-100 nm spatial resolution in mapping thermal resistance across a 15 nm-thick Al film deposited via e-beam evaporation on SiO_2 substrate. The thermal resistance maps are converted to thermal conductivity using robust analytical and finite element models that account for tip-sample geometry, lateral heat spreading, and buried interface effects. Gaussian distribution fitting of pixel-level thermal resistance values yields k_Al = 45.1(+4.7/-3.6) W/(m.K) for the ultra-thin Al film (13-15 nm), representing a 5.3-fold reduction from bulk aluminum (237 W/(m.K)). These results agree with published experimental data and theoretical frameworks explaining thickness-dependent heat transport in ultra-thin metallic films.