Copertina

Tiny Chiplets Enabled by Packaging Scaling: Opportunities in ESD Protection and Signal Integrity

Fuente: arXiv

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Dettagli Bibliografici
Autori principali:	Haque, Emad, Nalla, Pragnya Sudershan, Zhang, Jeff, Sapatnekar, Sachin S., Chakrabarti, Chaitali, Cao, Yu
Natura:	Preprint
Pubblicazione:	2025
Soggetti:	Hardware Architecture
Accesso online:	Acceder al recurso
Tags:	Aggiungi Tag Nessun Tag, puoi essere il primo ad aggiungerne!!

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