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Tiny Chiplets Enabled by Packaging Scaling: Opportunities in ESD Protection and Signal Integrity

Fuente: arXiv

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Detalles Bibliográficos
Autores principales:	Haque, Emad, Nalla, Pragnya Sudershan, Zhang, Jeff, Sapatnekar, Sachin S., Chakrabarti, Chaitali, Cao, Yu
Formato:	Preprint
Publicado:	2025
Materias:	Hardware Architecture
Acceso en línea:	Acceder al recurso
Etiquetas:	Agregar Etiqueta Sin Etiquetas, Sea el primero en etiquetar este registro!

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