ATMPlace: Analytical Thermo-Mechanical-Aware Placement Framework for 2.5D-IC

Fuente: arXiv
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Bibliographic Details
Main Authors: Wang, Qipan, Zhu, Tianxiang, Jia, Tianyu, Lin, Yibo, Wang, Runsheng, Huang, Ru
Format: Preprint
Published: 2025
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