Building 3D superconductor-based Josephson junctions using a via transfer approach

Fuente: arXiv

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Bibliographic Details
Main Authors:	Li, Cequn, Yi, Le, Halanayake, Kalana D., Thompson, Jessica L., Guan, Yingdong, Watanabe, Kenji, Taniguchi, Takashi, Mao, Zhiqiang, Hickey, Danielle Reifsnyder, Kayyalha, Morteza, Zhu, Jun
Format:	Preprint
Published:	2025
Subjects:	Mesoscale and Nanoscale Physics Materials Science Superconductivity
Online Access:	Acceder al recurso
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Internet

https://arxiv.org/abs/2511.17386