Copertina

Building 3D superconductor-based Josephson junctions using a via transfer approach

Fuente: arXiv

Salvato in:

Dettagli Bibliografici
Autori principali:	Li, Cequn, Yi, Le, Halanayake, Kalana D., Thompson, Jessica L., Guan, Yingdong, Watanabe, Kenji, Taniguchi, Takashi, Mao, Zhiqiang, Hickey, Danielle Reifsnyder, Kayyalha, Morteza, Zhu, Jun
Natura:	Preprint
Pubblicazione:	2025
Soggetti:	Mesoscale and Nanoscale Physics Materials Science Superconductivity
Accesso online:	Acceder al recurso
Tags:	Aggiungi Tag Nessun Tag, puoi essere il primo ad aggiungerne!!

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