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| Format: | Preprint |
| Veröffentlicht: |
2025
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| Schlagworte: | |
| Online-Zugang: | https://arxiv.org/abs/2511.23196 |
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| _version_ | 1866912735667683328 |
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| author | Gu, Ye Li, He Pannier, Tinus Niu, Shengpu Heise, Patrick Mai, Christian Ramaswamy, Prasanna Farrel, Alex Fecioru, Alin Trindade, Antonio Jose Loi, Ruggero Singh, Nishant Qin, Senbiao Pan, Biwei Zhang, Jing Rimbock, Johanna Dhaenens, Kristof De Baere, Toon Van Steenberge, Geert Bode, Dieter Velenis, Dimitrios Lepage, Guy Singh, Neha Van Campenhout, Joris Yin, Xin Roelkens, Gunther Ossieur, Peter |
| author_facet | Gu, Ye Li, He Pannier, Tinus Niu, Shengpu Heise, Patrick Mai, Christian Ramaswamy, Prasanna Farrel, Alex Fecioru, Alin Trindade, Antonio Jose Loi, Ruggero Singh, Nishant Qin, Senbiao Pan, Biwei Zhang, Jing Rimbock, Johanna Dhaenens, Kristof De Baere, Toon Van Steenberge, Geert Bode, Dieter Velenis, Dimitrios Lepage, Guy Singh, Neha Van Campenhout, Joris Yin, Xin Roelkens, Gunther Ossieur, Peter |
| contents | Meeting the escalating demands of data transmission and computing, driven by artificial intelligence (AI), requires not only faster optical transceivers but also advanced integration technologies that can seamlessly combine photonic and electronic components. Traditional approaches struggle to overcome the parasitic limitations arising from fabricating those components using different processes. Here, we report a novel 3D heterogeneously integrated optical receiver based on micro-transfer printing (μTP), enabling the co-integration of a compact bipolar CMOS (BiCMOS) electronic chiplet (0.06 mm2) directly onto a silicon photonic integrated circuit (SiPIC). While previous μTP demonstrations have focused primarily on photonic integration, our work pioneers the direct integration of electronics and photonics, significantly enhancing performance and scalability. The resulting optical receiver achieves 224 Gb/s four-level pulse amplitude modulation (PAM-4) operation, delivering -5.2 dBm optical modulation amplitude(OMA) sensitivity at a bit-error rate (BER) of 2.4 x 10-4, a record-small footprint, and an excellent power efficiency of 0.51 pJ/b. This demonstration not only showcases the potential of μTP for high-density, cost-efficient integration but also represents a critical step toward next-generation optical interconnects in the AI era. |
| format | Preprint |
| id |
arxiv_https___arxiv_org_abs_2511_23196 |
| institution | arXiv |
| publishDate | 2025 |
| record_format | arxiv |
| spellingShingle | A 3D-integrated BiCMOS-silicon photonics high-speed receiver realized using micro-transfer printing Gu, Ye Li, He Pannier, Tinus Niu, Shengpu Heise, Patrick Mai, Christian Ramaswamy, Prasanna Farrel, Alex Fecioru, Alin Trindade, Antonio Jose Loi, Ruggero Singh, Nishant Qin, Senbiao Pan, Biwei Zhang, Jing Rimbock, Johanna Dhaenens, Kristof De Baere, Toon Van Steenberge, Geert Bode, Dieter Velenis, Dimitrios Lepage, Guy Singh, Neha Van Campenhout, Joris Yin, Xin Roelkens, Gunther Ossieur, Peter Optics Meeting the escalating demands of data transmission and computing, driven by artificial intelligence (AI), requires not only faster optical transceivers but also advanced integration technologies that can seamlessly combine photonic and electronic components. Traditional approaches struggle to overcome the parasitic limitations arising from fabricating those components using different processes. Here, we report a novel 3D heterogeneously integrated optical receiver based on micro-transfer printing (μTP), enabling the co-integration of a compact bipolar CMOS (BiCMOS) electronic chiplet (0.06 mm2) directly onto a silicon photonic integrated circuit (SiPIC). While previous μTP demonstrations have focused primarily on photonic integration, our work pioneers the direct integration of electronics and photonics, significantly enhancing performance and scalability. The resulting optical receiver achieves 224 Gb/s four-level pulse amplitude modulation (PAM-4) operation, delivering -5.2 dBm optical modulation amplitude(OMA) sensitivity at a bit-error rate (BER) of 2.4 x 10-4, a record-small footprint, and an excellent power efficiency of 0.51 pJ/b. This demonstration not only showcases the potential of μTP for high-density, cost-efficient integration but also represents a critical step toward next-generation optical interconnects in the AI era. |
| title | A 3D-integrated BiCMOS-silicon photonics high-speed receiver realized using micro-transfer printing |
| topic | Optics |
| url | https://arxiv.org/abs/2511.23196 |