Laser Structured Optical Interposer for Ultra-dense Vertical Coupling of Multi-core Fibers to Silicon Photonic Chip
Fuente:
arXiv
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Preprint |
| Veröffentlicht: |
2025
|
| Schlagworte: | |
| Online-Zugang: | |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| _version_ | 1866917116519645184 |
|---|---|
| author | Djogo, Gligor Rahimnouri, Amir Herman, Peter R |
| author_facet | Djogo, Gligor Rahimnouri, Amir Herman, Peter R |
| contents | Femtosecond laser writing in glass was harnessed to fabricate photonic circuits comprised of waveguides, micro-mirrors, and fiber sockets, in an optical interposer chip. The compact design enabled ultra-dense routing of 40 optical channels from six multi-core fibers, in a two-layer array, vertically coupling onto a 2D grid of silicon photonic grating couplers. Various photonic circuit designs were explored and tested, achieving an average single-pass insertion loss of 5.0 dB for the fully packaged system, with a minimum loss of 3.2 dB. The reasonably low loss and low-profile, compact package make such interposers an attractive option for densifying interconnects to address bottlenecks in optical networks, datacenters, and optical computing applications. |
| format | Preprint |
| id |
arxiv_https___arxiv_org_abs_2512_01972 |
| institution | arXiv |
| publishDate | 2025 |
| record_format | arxiv |
| spellingShingle | Laser Structured Optical Interposer for Ultra-dense Vertical Coupling of Multi-core Fibers to Silicon Photonic Chip Djogo, Gligor Rahimnouri, Amir Herman, Peter R Optics Applied Physics Femtosecond laser writing in glass was harnessed to fabricate photonic circuits comprised of waveguides, micro-mirrors, and fiber sockets, in an optical interposer chip. The compact design enabled ultra-dense routing of 40 optical channels from six multi-core fibers, in a two-layer array, vertically coupling onto a 2D grid of silicon photonic grating couplers. Various photonic circuit designs were explored and tested, achieving an average single-pass insertion loss of 5.0 dB for the fully packaged system, with a minimum loss of 3.2 dB. The reasonably low loss and low-profile, compact package make such interposers an attractive option for densifying interconnects to address bottlenecks in optical networks, datacenters, and optical computing applications. |
| title | Laser Structured Optical Interposer for Ultra-dense Vertical Coupling of Multi-core Fibers to Silicon Photonic Chip |
| topic | Optics Applied Physics |
| url | https://arxiv.org/abs/2512.01972 |