APA (7th ed.) Citation

Mishra, H., Kozuka, Y., Bonam, S., Uzuhashi, J., Suggisetti, P., Ohkubo, T., & Singh, S. G. (2025). Demonstration of surface-engineered oxidation-resistant Nb-Nb thermocompression bonding toward scalable superconducting quantum computing architectures.

Chicago Style (17th ed.) Citation

Mishra, Harsh, Yusuke Kozuka, Sathish Bonam, Jun Uzuhashi, Praveenkumar Suggisetti, Tadakatsu Ohkubo, and Shiv Govind Singh. Demonstration of Surface-engineered Oxidation-resistant Nb-Nb Thermocompression Bonding Toward Scalable Superconducting Quantum Computing Architectures. 2025.

MLA (9th ed.) Citation

Mishra, Harsh, et al. Demonstration of Surface-engineered Oxidation-resistant Nb-Nb Thermocompression Bonding Toward Scalable Superconducting Quantum Computing Architectures. 2025.