Terahertz Signal Coverage Enhancement in Hall Scenarios Based on Single-Hop and Dual-Hop Reconfigurable Intelligent Surfaces

Fuente: arXiv
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Bibliographic Details
Main Authors: Chen, Ben, Zhong, Zhangdui, Guan, Ke, He, Danping, Wang, Yiran, Ding, Jianwen, Luo, Qi
Format: Preprint
Published: 2025
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