Realization of Insulating Buffer Layers via MOCVD-Grown Nitrogen-Doped (010) \b{eta}-Ga2O3

Fuente: arXiv
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Main Authors: Kahler, Rachel, Peterson, Carl, Krishnamoorthy, Sriram
Format: Preprint
Published: 2025
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author Kahler, Rachel
Peterson, Carl
Krishnamoorthy, Sriram
author_facet Kahler, Rachel
Peterson, Carl
Krishnamoorthy, Sriram
contents We present MOCVD-grown, nitrogen-doped \b{eta}-Ga2O3 films as an insulating buffer layer on Fe-doped (010) \b{eta}-Ga2O3 substrates in lieu of 49% HF treatment to remove unintentional silicon at the substrate-epitaxial layer growth interface. N-doped layer thickness and NH3 flow were systematically varied to experimentally determine the lowest nitrogen concentration and thickness of the buffer layer needed to fully compensate the interfacial silicon peak. The NH3 molar flow rate was varied from 200 sccm to 1800 sccm. Results showed fully insulating N-doped layers for samples with NH3 flow rates greater than or equal to 1200 sccm and a thickness of 50 nm. This study demonstrates the efficacy of in-situ, controllably doped nitrogen buffer layers as a mitigation method for unintentional interfacial silicon at the substrate-epitaxial layer growth interface.
format Preprint
id arxiv_https___arxiv_org_abs_2512_20989
institution arXiv
publishDate 2025
record_format arxiv
spellingShingle Realization of Insulating Buffer Layers via MOCVD-Grown Nitrogen-Doped (010) \b{eta}-Ga2O3
Kahler, Rachel
Peterson, Carl
Krishnamoorthy, Sriram
Materials Science
Applied Physics
We present MOCVD-grown, nitrogen-doped \b{eta}-Ga2O3 films as an insulating buffer layer on Fe-doped (010) \b{eta}-Ga2O3 substrates in lieu of 49% HF treatment to remove unintentional silicon at the substrate-epitaxial layer growth interface. N-doped layer thickness and NH3 flow were systematically varied to experimentally determine the lowest nitrogen concentration and thickness of the buffer layer needed to fully compensate the interfacial silicon peak. The NH3 molar flow rate was varied from 200 sccm to 1800 sccm. Results showed fully insulating N-doped layers for samples with NH3 flow rates greater than or equal to 1200 sccm and a thickness of 50 nm. This study demonstrates the efficacy of in-situ, controllably doped nitrogen buffer layers as a mitigation method for unintentional interfacial silicon at the substrate-epitaxial layer growth interface.
title Realization of Insulating Buffer Layers via MOCVD-Grown Nitrogen-Doped (010) \b{eta}-Ga2O3
topic Materials Science
Applied Physics
url https://arxiv.org/abs/2512.20989