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Autores principales: Kaufmann, Johannes, Siefke, Thomas, Zeitner, Uwe
Formato: Preprint
Publicado: 2026
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Acceso en línea:https://arxiv.org/abs/2601.04667
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author Kaufmann, Johannes
Siefke, Thomas
Zeitner, Uwe
author_facet Kaufmann, Johannes
Siefke, Thomas
Zeitner, Uwe
contents Controlled and precise fabrication of structures with heights in the range of single digit nanometres is one of the challenges for diffraction gratings operating near-normal incidence in the extreme ultraviolet (EUV) and soft X-ray range. Here, we expand on previous research utilizing swelling of silicon after irradiation with ions as alternative to conventional dry etching. By irradiating silicon through a mask with a broad beam of nitrogen ions, we realized lamellar gratings in a precise and well controlled process. We were able to fabricate gratings with structure heights between (1.00 +/- 0.05) nm to (10.0 +/- 0.5) nm and a pitch of 1 micrometre, which is suitable for both EUV and soft X-ray applications. A variation of ion energy from 20 keV to 40 keV further expands the foundations of this process and yielded an additional parameter to control the resulting structure height and shape.
format Preprint
id arxiv_https___arxiv_org_abs_2601_04667
institution arXiv
publishDate 2026
record_format arxiv
spellingShingle Ultra-shallow EUV and soft X-ray gratings fabricated by broad-beam nitrogen ion irradiation
Kaufmann, Johannes
Siefke, Thomas
Zeitner, Uwe
Applied Physics
Controlled and precise fabrication of structures with heights in the range of single digit nanometres is one of the challenges for diffraction gratings operating near-normal incidence in the extreme ultraviolet (EUV) and soft X-ray range. Here, we expand on previous research utilizing swelling of silicon after irradiation with ions as alternative to conventional dry etching. By irradiating silicon through a mask with a broad beam of nitrogen ions, we realized lamellar gratings in a precise and well controlled process. We were able to fabricate gratings with structure heights between (1.00 +/- 0.05) nm to (10.0 +/- 0.5) nm and a pitch of 1 micrometre, which is suitable for both EUV and soft X-ray applications. A variation of ion energy from 20 keV to 40 keV further expands the foundations of this process and yielded an additional parameter to control the resulting structure height and shape.
title Ultra-shallow EUV and soft X-ray gratings fabricated by broad-beam nitrogen ion irradiation
topic Applied Physics
url https://arxiv.org/abs/2601.04667