APA (7th ed.) Citation

Wang, Q., Zhu, T., Lin, Y., Wang, R., & Huang, R. (2026). ATSim3D: Towards Accurate Thermal Simulator for Heterogeneous 3D-IC Systems Considering Nonlinear Leakage and Conductivity.

Chicago Style (17th ed.) Citation

Wang, Qipan, Tianxiang Zhu, Yibo Lin, Runsheng Wang, and Ru Huang. ATSim3D: Towards Accurate Thermal Simulator for Heterogeneous 3D-IC Systems Considering Nonlinear Leakage and Conductivity. 2026.

MLA (9th ed.) Citation

Wang, Qipan, et al. ATSim3D: Towards Accurate Thermal Simulator for Heterogeneous 3D-IC Systems Considering Nonlinear Leakage and Conductivity. 2026.