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| Hauptverfasser: | , , , , |
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| Format: | Preprint |
| Veröffentlicht: |
2026
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| Schlagworte: | |
| Online-Zugang: | https://arxiv.org/abs/2601.11050 |
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| _version_ | 1866915734470262784 |
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| author | Wang, Qipan Zhu, Tianxiang Lin, Yibo Wang, Runsheng Huang, Ru |
| author_facet | Wang, Qipan Zhu, Tianxiang Lin, Yibo Wang, Runsheng Huang, Ru |
| contents | Thermal simulation plays a fundamental role in the thermal design of integrated circuits, especially 3D ICs. Current simulators require significant runtime for high-resolution simulation, and dismiss the complex nonlinear thermal effects, such as nonlinear thermal conductivity and leakage power. To address these issues, we propose ATSim3D, a thermal simulator for simulating the steady-state temperature profile of nonlinear and heterogeneous 3D IC systems. We utilize the global-local approach, combining a compact thermal model at the global level, and a finite volume method at the local level. We tackle the nonlinear effects with Kirchhoff transformation and iteration. ATSim3D enables local-level parallelization that helps achieve an average speedup of 40x compared to COMSOL, with a relative error <3% and a state-of-the-art resolution of 4096 x 4096, holding promise for enhancing thermal-aware design in 3D ICs. |
| format | Preprint |
| id |
arxiv_https___arxiv_org_abs_2601_11050 |
| institution | arXiv |
| publishDate | 2026 |
| record_format | arxiv |
| spellingShingle | ATSim3D: Towards Accurate Thermal Simulator for Heterogeneous 3D-IC Systems Considering Nonlinear Leakage and Conductivity Wang, Qipan Zhu, Tianxiang Lin, Yibo Wang, Runsheng Huang, Ru Applied Physics Thermal simulation plays a fundamental role in the thermal design of integrated circuits, especially 3D ICs. Current simulators require significant runtime for high-resolution simulation, and dismiss the complex nonlinear thermal effects, such as nonlinear thermal conductivity and leakage power. To address these issues, we propose ATSim3D, a thermal simulator for simulating the steady-state temperature profile of nonlinear and heterogeneous 3D IC systems. We utilize the global-local approach, combining a compact thermal model at the global level, and a finite volume method at the local level. We tackle the nonlinear effects with Kirchhoff transformation and iteration. ATSim3D enables local-level parallelization that helps achieve an average speedup of 40x compared to COMSOL, with a relative error <3% and a state-of-the-art resolution of 4096 x 4096, holding promise for enhancing thermal-aware design in 3D ICs. |
| title | ATSim3D: Towards Accurate Thermal Simulator for Heterogeneous 3D-IC Systems Considering Nonlinear Leakage and Conductivity |
| topic | Applied Physics |
| url | https://arxiv.org/abs/2601.11050 |