Multi-Partner Project: COIN-3D -- Collaborative Innovation in 3D VLSI Reliability

Fuente: arXiv

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Bibliographic Details
Main Authors:	Gourdoumanis, George Rafael, Oikonomou, Fotoini, Pantazi-Kypraiou, Maria, Stoikos, Pavlos, Axelou, Olympia, Tziouvaras, Athanasios, Karakonstantis, Georgios, Aladwani, Tahani, Anagnostopoulos, Christos, Shen, Yixian, Pathania, Anuj, Garcia-Ortiz, Alberto, Floros, George
Format:	Preprint
Published:	2026
Subjects:	Hardware Architecture
Online Access:	Acceder al recurso
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