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| Main Authors: | , , , , |
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| Format: | Preprint |
| Published: |
2026
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| Subjects: | |
| Online Access: | https://arxiv.org/abs/2601.14576 |
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| _version_ | 1866914271873466368 |
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| author | Nydegger, Mirco Gallivan, Rebecca A. Barras, Arthur Galinski, Henning Spolenak, Ralph |
| author_facet | Nydegger, Mirco Gallivan, Rebecca A. Barras, Arthur Galinski, Henning Spolenak, Ralph |
| contents | The fabrication of functional micro- and nano-electronic devices requires the deposition of high-quality materials of different electronic material classes, such as conductors, semiconductors and insulators. To establish ultra-high-resolution additive manufacturing as a viable addition to existing fabrication methods requires the combinatorial additive deposition of different electronic material classes. However, current techniques do not provide such a capability. Here, we demonstrate that droplet confined electroplating, an ultra-high-resolution AM technique initially developed for metals as electrohydrodynamic redox printing (EHD-RP), allows not only the direct deposition of many metals, but also of metal-oxides. Particularly, we demonstrate that applying fundamental electrochemical principles in combination with on-the-fly switching of the deposited material allows for the direct co-deposition of metals, metal-hydroxides and -oxides. Our results exemplify the feasibility of leveraging simple water-based electrochemical concepts to produce intricate and multi-material structures at the nanoscale. |
| format | Preprint |
| id |
arxiv_https___arxiv_org_abs_2601_14576 |
| institution | arXiv |
| publishDate | 2026 |
| record_format | arxiv |
| spellingShingle | Nanodroplet-Confined Electroplating Enables Submicron Printing of Metals and Oxide Ceramics Nydegger, Mirco Gallivan, Rebecca A. Barras, Arthur Galinski, Henning Spolenak, Ralph Materials Science The fabrication of functional micro- and nano-electronic devices requires the deposition of high-quality materials of different electronic material classes, such as conductors, semiconductors and insulators. To establish ultra-high-resolution additive manufacturing as a viable addition to existing fabrication methods requires the combinatorial additive deposition of different electronic material classes. However, current techniques do not provide such a capability. Here, we demonstrate that droplet confined electroplating, an ultra-high-resolution AM technique initially developed for metals as electrohydrodynamic redox printing (EHD-RP), allows not only the direct deposition of many metals, but also of metal-oxides. Particularly, we demonstrate that applying fundamental electrochemical principles in combination with on-the-fly switching of the deposited material allows for the direct co-deposition of metals, metal-hydroxides and -oxides. Our results exemplify the feasibility of leveraging simple water-based electrochemical concepts to produce intricate and multi-material structures at the nanoscale. |
| title | Nanodroplet-Confined Electroplating Enables Submicron Printing of Metals and Oxide Ceramics |
| topic | Materials Science |
| url | https://arxiv.org/abs/2601.14576 |