Xiao, B., Li, N., Kong, W., Chu, R., Zhang, H., Meng, G., . . . Cheng, Y. (2026). FEcMD: A multi-physics and multi-scale computational program for dynamic coupling molecular dynamics simulations with transient electric field and heat conduction in metal nanostructures.
Chicago-Zitierstil (17. Ausg.)Xiao, Bing, Nan Li, Wenqian Kong, Rui Chu, Hongyu Zhang, Guodong Meng, Kai Wu, und Yonghong Cheng. FEcMD: A Multi-physics and Multi-scale Computational Program for Dynamic Coupling Molecular Dynamics Simulations with Transient Electric Field and Heat Conduction in Metal Nanostructures. 2026.
MLA-Zitierstil (9. Ausg.)Xiao, Bing, et al. FEcMD: A Multi-physics and Multi-scale Computational Program for Dynamic Coupling Molecular Dynamics Simulations with Transient Electric Field and Heat Conduction in Metal Nanostructures. 2026.