APA (7th ed.) Citation

Sharma, A., Gorane, A., Riedler, P., & Weick, J. (2026). Development of Low-Mass Flex PCB and Nanowire Interconnect Technologies for HEP Module Integration.

Chicago Style (17th ed.) Citation

Sharma, Abhishek, Atul Gorane, Petra Riedler, and Julian Weick. Development of Low-Mass Flex PCB and Nanowire Interconnect Technologies for HEP Module Integration. 2026.

MLA (9th ed.) Citation

Sharma, Abhishek, et al. Development of Low-Mass Flex PCB and Nanowire Interconnect Technologies for HEP Module Integration. 2026.