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Hauptverfasser: Sharma, Abhishek, Gorane, Atul, Riedler, Petra, Weick, Julian
Format: Preprint
Veröffentlicht: 2026
Schlagworte:
Online-Zugang:https://arxiv.org/abs/2601.17029
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author Sharma, Abhishek
Gorane, Atul
Riedler, Petra
Weick, Julian
author_facet Sharma, Abhishek
Gorane, Atul
Riedler, Petra
Weick, Julian
contents The development of lightweight flex PCBs and nanowire-based thermal interfaces for low-mass, high-performance detector modules are presented. A novel manufacturing approach targeting flex circuits with double-sided pad access, assembled using ACF and gold studs. Signal integrity was simulated and validation trials conducted on test structures. For thermal management, sintered nanowire interfaces were evaluated. These results contribute quantitative input relevant to minimal-mass, scalable packaging in HEP detectors.
format Preprint
id arxiv_https___arxiv_org_abs_2601_17029
institution arXiv
publishDate 2026
record_format arxiv
spellingShingle Development of Low-Mass Flex PCB and Nanowire Interconnect Technologies for HEP Module Integration
Sharma, Abhishek
Gorane, Atul
Riedler, Petra
Weick, Julian
Instrumentation and Detectors
High Energy Physics - Experiment
The development of lightweight flex PCBs and nanowire-based thermal interfaces for low-mass, high-performance detector modules are presented. A novel manufacturing approach targeting flex circuits with double-sided pad access, assembled using ACF and gold studs. Signal integrity was simulated and validation trials conducted on test structures. For thermal management, sintered nanowire interfaces were evaluated. These results contribute quantitative input relevant to minimal-mass, scalable packaging in HEP detectors.
title Development of Low-Mass Flex PCB and Nanowire Interconnect Technologies for HEP Module Integration
topic Instrumentation and Detectors
High Energy Physics - Experiment
url https://arxiv.org/abs/2601.17029