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Toward Digital Twins in 3D IC Packaging: A Critical Review of Physics, Data, and Hybrid Architectures

Fuente: arXiv

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Bibliographic Details
Main Authors:	Datta, Gourab, Sharif, Sarah Safura, Banad, Yaser Mike
Format:	Preprint
Published:	2026
Subjects:	Hardware Architecture Emerging Technologies
Online Access:	Acceder al recurso
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