Wafer-Scale Micro-Knife Sealed Vacuum Cells for Quantum Devices
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arXiv
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| Format: | Preprint |
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2026
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| author | Kelleher, Megan Lauree Ziegler, Konrad Robin, Jeremy Huang, Lianxin Button, Mitchel Mauck, Liam Olson, Judith Brewer, Peter Kim, Danny Kitching, John Senaratne, Ruwan McGehee, William R. Autry, Travis M. |
| author_facet | Kelleher, Megan Lauree Ziegler, Konrad Robin, Jeremy Huang, Lianxin Button, Mitchel Mauck, Liam Olson, Judith Brewer, Peter Kim, Danny Kitching, John Senaratne, Ruwan McGehee, William R. Autry, Travis M. |
| contents | Advanced integration technologies greatly enhance the prospects and reliability of practical quantum sensors, atomic clocks, and quantum information technologies. The performance and proliferation of these devices at chip-scale is contingent upon developing low leak and low gas permeation vacuum cells using wafer-scale techniques. Here we demonstrate both evacuated atomic beam cells and atomic vapor cells using plastic deformation micro-knife bonding of selectively etched fused silica wafers. The cells are characterized using saturated absorption spectroscopy and fluorescence measurements. Vapor cells are mechanically robust exhibiting sheer-force strength ($\sim 15$MPa), demonstrate long lifetimes ($> 1$ year), low residual gas pressures $ (\ll 10^{-3} \, \text{mbar}) $, and leak rates below fine-leak testing sensitivity ($\ll 2.8 \times 10^{-10} \frac{\text{mBar} \cdot \text{L}}{\text{s}}$). Micro-knife bonding greatly simplifies the fabrication process for complex chip scale atom-beam devices and atomic vapor cells while identifying a path to future chip-scale cold atom devices, improved chip scale atomic clocks, and fieldable dissipation-dilution-limited optomechanics. |
| format | Preprint |
| id |
arxiv_https___arxiv_org_abs_2602_00390 |
| institution | arXiv |
| publishDate | 2026 |
| record_format | arxiv |
| spellingShingle | Wafer-Scale Micro-Knife Sealed Vacuum Cells for Quantum Devices Kelleher, Megan Lauree Ziegler, Konrad Robin, Jeremy Huang, Lianxin Button, Mitchel Mauck, Liam Olson, Judith Brewer, Peter Kim, Danny Kitching, John Senaratne, Ruwan McGehee, William R. Autry, Travis M. Atomic Physics Advanced integration technologies greatly enhance the prospects and reliability of practical quantum sensors, atomic clocks, and quantum information technologies. The performance and proliferation of these devices at chip-scale is contingent upon developing low leak and low gas permeation vacuum cells using wafer-scale techniques. Here we demonstrate both evacuated atomic beam cells and atomic vapor cells using plastic deformation micro-knife bonding of selectively etched fused silica wafers. The cells are characterized using saturated absorption spectroscopy and fluorescence measurements. Vapor cells are mechanically robust exhibiting sheer-force strength ($\sim 15$MPa), demonstrate long lifetimes ($> 1$ year), low residual gas pressures $ (\ll 10^{-3} \, \text{mbar}) $, and leak rates below fine-leak testing sensitivity ($\ll 2.8 \times 10^{-10} \frac{\text{mBar} \cdot \text{L}}{\text{s}}$). Micro-knife bonding greatly simplifies the fabrication process for complex chip scale atom-beam devices and atomic vapor cells while identifying a path to future chip-scale cold atom devices, improved chip scale atomic clocks, and fieldable dissipation-dilution-limited optomechanics. |
| title | Wafer-Scale Micro-Knife Sealed Vacuum Cells for Quantum Devices |
| topic | Atomic Physics |
| url | https://arxiv.org/abs/2602.00390 |