Hou, D., Yao, Y., Cheng, X., Ding, S., Wu, Q., Hu, Y., . . . Jin, C. (2026). 2.5D co-packaged optical I/O chipsets on a SiON/Si interposer for 4 $\times$ 100G optical interconnection.
Chicago Style (17th ed.) CitationHou, Daibao, et al. 2.5D Co-packaged Optical I/O Chipsets on a SiON/Si Interposer for 4 $\times$ 100G Optical Interconnection. 2026.
MLA (9th ed.) CitationHou, Daibao, et al. 2.5D Co-packaged Optical I/O Chipsets on a SiON/Si Interposer for 4 $\times$ 100G Optical Interconnection. 2026.
Warning: These citations may not always be 100% accurate.