2.5D co-packaged optical I/O chipsets on a SiON/Si interposer for 4 $\times$ 100G optical interconnection
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arXiv
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| Auteurs principaux: | Hou, Daibao, Yao, Yuntian, Cheng, Xiaotian, Ding, Shuning, Wu, Qiyou, Hu, Yonghong, Pan, Wei, Huang, Chao, Zhu, Huihui, Huang, Yongzhen, Li, Chenhui, Jin, Chaoyuan |
|---|---|
| Format: | Preprint |
| Publié: |
2026
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