Single-exposure holographic lithography of ultra-high aspect-ratio microstructures
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arXiv
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| Format: | Preprint |
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2026
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| _version_ | 1866908829345644544 |
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| author | Lin, Dajun Baker, Brian Menon, Rajesh |
| author_facet | Lin, Dajun Baker, Brian Menon, Rajesh |
| contents | Volumetric lithography offers a path to scalable fabrication of complex three-dimensional (3D) micro- and nanoscale architectures, yet existing approaches are limited by quasi-two-dimensional exposure physics or slow serial writing. We present a single-exposure volumetric fabrication strategy that enables creation of ultrahigh-aspect-ratio 3D structures with 6 um minimum features. An inverse-designed volumetric (holographic) phase mask generates an extended-depth-of-field intensity distribution inside a photoresist volume while preserving high transverse resolution, enabling uniform polymerization of the full volume in a single exposure. With exposure times of approximately 20 s, we fabricate lattices, Penrose tilings, and micromechanical elements with feature sizes down to 6 um over volumes up to 800 x 800 x 720 um^3, achieving aspect ratios exceeding 120:1. Quantitative analysis of capillary flow in hollow lattices demonstrates controlled fluid transport with an effective capillary transport coefficient of 176.3 um/(ms)^(1/2). In situ nanoindentation-based micro-compression reveals that the printed 3D hexagonal close-packed lattices exhibit a well-defined linear elastic regime with an effective Young's modulus of 5.7 GPa, followed by progressive buckling and densification characteristic of mechanically robust cellular architectures. Overlapping, tilted and multi-mask exposures further enable quasi-3D complex geometries with potential for reconfigurability. This approach establishes a new regime of high-throughput volumetric fabrication. |
| format | Preprint |
| id |
arxiv_https___arxiv_org_abs_2602_11508 |
| institution | arXiv |
| publishDate | 2026 |
| record_format | arxiv |
| spellingShingle | Single-exposure holographic lithography of ultra-high aspect-ratio microstructures Lin, Dajun Baker, Brian Menon, Rajesh Optics Applied Physics Volumetric lithography offers a path to scalable fabrication of complex three-dimensional (3D) micro- and nanoscale architectures, yet existing approaches are limited by quasi-two-dimensional exposure physics or slow serial writing. We present a single-exposure volumetric fabrication strategy that enables creation of ultrahigh-aspect-ratio 3D structures with 6 um minimum features. An inverse-designed volumetric (holographic) phase mask generates an extended-depth-of-field intensity distribution inside a photoresist volume while preserving high transverse resolution, enabling uniform polymerization of the full volume in a single exposure. With exposure times of approximately 20 s, we fabricate lattices, Penrose tilings, and micromechanical elements with feature sizes down to 6 um over volumes up to 800 x 800 x 720 um^3, achieving aspect ratios exceeding 120:1. Quantitative analysis of capillary flow in hollow lattices demonstrates controlled fluid transport with an effective capillary transport coefficient of 176.3 um/(ms)^(1/2). In situ nanoindentation-based micro-compression reveals that the printed 3D hexagonal close-packed lattices exhibit a well-defined linear elastic regime with an effective Young's modulus of 5.7 GPa, followed by progressive buckling and densification characteristic of mechanically robust cellular architectures. Overlapping, tilted and multi-mask exposures further enable quasi-3D complex geometries with potential for reconfigurability. This approach establishes a new regime of high-throughput volumetric fabrication. |
| title | Single-exposure holographic lithography of ultra-high aspect-ratio microstructures |
| topic | Optics Applied Physics |
| url | https://arxiv.org/abs/2602.11508 |