Ultralow and Tunable Thermal Conductivity of Parylene C for Thermal Insulation in Advanced Packaging

Fuente: arXiv

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Bibliographic Details
Main Authors:	Wei, Yicheng, Xu, Han, Zhang, Xingqiang, Wang, Wei, Cheng, Zhe
Format:	Preprint
Published:	2026
Subjects:	Materials Science Applied Physics
Online Access:	Acceder al recurso
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Internet

https://arxiv.org/abs/2603.03737