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Network Design for Wafer-Scale Systems with Wafer-on-Wafer Hybrid Bonding

Fuente: arXiv

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Bibliographic Details
Main Authors:	Iff, Patrick, Bonato, Tommaso, Besta, Maciej, Benini, Luca, Hoefler, Torsten
Format:	Preprint
Published:	2026
Subjects:	Hardware Architecture
Online Access:	Acceder al recurso
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