Saved in:
Bibliographic Details
Main Authors: Qian, Fangsheng, Chen, Shuhan, Wei, Wei, Xu, Jiashuai, Yang, Kai, Zheng, Junyan, Ren, Zijun, Liu, Xingyu, Yang, Yansong
Format: Preprint
Published: 2026
Subjects:
Online Access:https://arxiv.org/abs/2603.10557
Tags: Add Tag
No Tags, Be the first to tag this record!
_version_ 1866914507332255744
author Qian, Fangsheng
Chen, Shuhan
Wei, Wei
Xu, Jiashuai
Yang, Kai
Zheng, Junyan
Ren, Zijun
Liu, Xingyu
Yang, Yansong
author_facet Qian, Fangsheng
Chen, Shuhan
Wei, Wei
Xu, Jiashuai
Yang, Kai
Zheng, Junyan
Ren, Zijun
Liu, Xingyu
Yang, Yansong
contents High-frequency acoustic wave transducers, vibrating at gigahertz (GHz), favored for their compact size, are not only dominating the front-end of mobile handsets but are also expanding into various interdisciplinary fields, including quantum acoustics, acoustic-optics, acoustic-fluids, acoustoelectric, and sustainable power conversion systems. However, like strong vibration can "shake off" substances and produce heat, a long-standing bottleneck has been the ability to harness acoustics under high-power vibration loads, while simultaneously suppressing temperature rise, especially for IDT-based surface acoustic wave (SAW) systems. Here, we proposed a layered acoustic wave (LAW) platform, utilizing a quasi-infinite multifunctional top layer, that redefines mechanical and thermal boundary conditions to overcome three fundamental challenges in high-power acoustic wave vibration: self-heating, thermal instability, and acoustomigration. By simply leveraging a simplified, thick single-material overlayer to achieve electro-thermo-mechanical co-design, this acoustic platform moves beyond prior substrate-focused thermal management in SAW technology. It demonstrates, for the first time from the top boundary, simultaneous redistribution of the von Mises stress field and the creation of an efficient vertical thermal dissipation path. The LAW transducer, vibrating at over 2 GHz, achieves a 70% reduction in temperature rise under identical power loads, a first-order temperature coefficient of frequency (TCF) of -13 ppm/C with minimal dispersion, and an unprecedented threshold power density of 45.61 dBm/mm2 - over one order-of-magnitude higher than that of state-of-the-art thin-film surface acoustic wave (TF-SAW) counterparts at the same wavelength.
format Preprint
id arxiv_https___arxiv_org_abs_2603_10557
institution arXiv
publishDate 2026
record_format arxiv
spellingShingle Suppressing Acoustomigration and Temperature Rise for High-power Robust Acoustics
Qian, Fangsheng
Chen, Shuhan
Wei, Wei
Xu, Jiashuai
Yang, Kai
Zheng, Junyan
Ren, Zijun
Liu, Xingyu
Yang, Yansong
Signal Processing
Systems and Control
High-frequency acoustic wave transducers, vibrating at gigahertz (GHz), favored for their compact size, are not only dominating the front-end of mobile handsets but are also expanding into various interdisciplinary fields, including quantum acoustics, acoustic-optics, acoustic-fluids, acoustoelectric, and sustainable power conversion systems. However, like strong vibration can "shake off" substances and produce heat, a long-standing bottleneck has been the ability to harness acoustics under high-power vibration loads, while simultaneously suppressing temperature rise, especially for IDT-based surface acoustic wave (SAW) systems. Here, we proposed a layered acoustic wave (LAW) platform, utilizing a quasi-infinite multifunctional top layer, that redefines mechanical and thermal boundary conditions to overcome three fundamental challenges in high-power acoustic wave vibration: self-heating, thermal instability, and acoustomigration. By simply leveraging a simplified, thick single-material overlayer to achieve electro-thermo-mechanical co-design, this acoustic platform moves beyond prior substrate-focused thermal management in SAW technology. It demonstrates, for the first time from the top boundary, simultaneous redistribution of the von Mises stress field and the creation of an efficient vertical thermal dissipation path. The LAW transducer, vibrating at over 2 GHz, achieves a 70% reduction in temperature rise under identical power loads, a first-order temperature coefficient of frequency (TCF) of -13 ppm/C with minimal dispersion, and an unprecedented threshold power density of 45.61 dBm/mm2 - over one order-of-magnitude higher than that of state-of-the-art thin-film surface acoustic wave (TF-SAW) counterparts at the same wavelength.
title Suppressing Acoustomigration and Temperature Rise for High-power Robust Acoustics
topic Signal Processing
Systems and Control
url https://arxiv.org/abs/2603.10557