Yang, G., Tang, X., Lin, Z., Gu, Y., Hao, W., Du, Y., & Wei, X. (2026). Tuning Cu/Diamond Interfacial Thermal Conductance via Nitrogen-Termination Engineering.
Style de citation Chicago (17e éd.)Yang, Guang, Xinling Tang, Zhongkang Lin, Yulin Gu, Wei Hao, Yujie Du, et Xiaoguang Wei. Tuning Cu/Diamond Interfacial Thermal Conductance via Nitrogen-Termination Engineering. 2026.
Style de citation MLA (9e éd.)Yang, Guang, et al. Tuning Cu/Diamond Interfacial Thermal Conductance via Nitrogen-Termination Engineering. 2026.
Attention : ces citations peuvent ne pas être correctes à 100%.