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Tuning Cu/Diamond Interfacial Thermal Conductance via Nitrogen-Termination Engineering

Fuente: arXiv

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Détails bibliographiques
Auteurs principaux:	Yang, Guang, Tang, Xinling, Lin, Zhongkang, Gu, Yulin, Hao, Wei, Du, Yujie, Wei, Xiaoguang
Format:	Preprint
Publié:	2026
Sujets:	Computational Physics Materials Science
Accès en ligne:	Acceder al recurso
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