Imagen de Portada

DS2SC-Agent: A Multi-Agent Automated Pipeline for Rapid Chiplet Model Generation

Fuente: arXiv

Guardado en:

Detalles Bibliográficos
Autores principales:	Wu, Yiwei, Wu, Yifan, Xiong, Yunhao, Zhao, Dengwei, Shen, Jiaxuan, Jiang, Jianfei, He, Guanghui, Tu, Shikui, Sun, Yanan
Formato:	Preprint
Publicado:	2026
Materias:	Hardware Architecture
Acceso en línea:	Acceder al recurso
Etiquetas:	Agregar Etiqueta Sin Etiquetas, Sea el primero en etiquetar este registro!

Ejemplares similares

RapidChiplet: A Toolchain for Rapid Design Space Exploration of Chiplet Architectures
por: Iff, Patrick, et al.
Publicado: (2023)

CHICO-Agent: An LLM Agent for the Cross-layer Optimization of 2.5D and 3D Chiplet-based Systems
por: Wu, Qihang, et al.
Publicado: (2026)

Chiplet Actuary: A Quantitative Cost Model and Multi-Chiplet Architecture Exploration
por: Feng, Yinxiao, et al.
Publicado: (2022)

VEDA: Efficient LLM Generation Through Voting-based KV Cache Eviction and Dataflow-flexible Accelerator
por: Wang, Zhican, et al.
Publicado: (2025)

Mapping Space Exploration for Multi-Chiplet Accelerators Targeting LLM Inference Serving Workloads
por: Li, Boyu, et al.
Publicado: (2025)

Chiplets on Wheels: Review Paper on Holistic Chiplet Solutions for Autonomous Vehicles
por: Narashiman, Swathi, et al.
Publicado: (2024)

RFAmpDesigner: A Self-Evolving Multi-Agent LLM Framework for Automated Radio Frequency Amplifier Design
por: Lu, Hang, et al.
Publicado: (2026)

Chiplet-Gym: Optimizing Chiplet-based AI Accelerator Design with Reinforcement Learning
por: Mishty, Kaniz, et al.
Publicado: (2024)

ChipLight: Cross-Layer Optimization of Chiplet Design with Optical Interconnects for LLM Training
por: Bai, Kangbo, et al.
Publicado: (2026)

Lifecycle Cost-Effectiveness Modeling for Redundancy-Enhanced Multi-Chiplet Architectures
por: Liu, Zizhen, et al.
Publicado: (2026)

FoldedHexaTorus: An Inter-Chiplet Interconnect Topology for Chiplet-based Systems using Organic and Glass Substrates
por: Iff, Patrick, et al.
Publicado: (2025)

PICNIC: Silicon Photonic Interconnected Chiplets with Computational Network and In-memory Computing for LLM Inference Acceleration
por: Chong, Yue Jiet, et al.
Publicado: (2025)

MAHL: Multi-Agent LLM-Guided Hierarchical Chiplet Design with Adaptive Debugging
por: Tang, Jinwei, et al.
Publicado: (2025)

Multi-Objective Hardware-Mapping Co-Optimisation for Multi-DNN Workloads on Chiplet-based Accelerators
por: Das, Abhijit, et al.
Publicado: (2022)

Link Quality Aware Pathfinding for Chiplet Interconnects
por: Yen, Aaron, et al.
Publicado: (2026)

THERMOS: Thermally-Aware Multi-Objective Scheduling of AI Workloads on Heterogeneous Multi-Chiplet PIM Architectures
por: Kanani, Alish, et al.
Publicado: (2025)

MFIT: Multi-Fidelity Thermal Modeling for 2.5D and 3D Multi-Chiplet Architectures
por: Pfromm, Lukas, et al.
Publicado: (2024)

PlaceIT: Placement-based Inter-Chiplet Interconnect Topologies
por: Iff, Patrick, et al.
Publicado: (2025)

The Survey of Chiplet-based Integrated Architecture: An EDA perspective
por: Chen, Shixin, et al.
Publicado: (2024)

Cambricon-LLM: A Chiplet-Based Hybrid Architecture for On-Device Inference of 70B LLM
por: Yu, Zhongkai, et al.
Publicado: (2024)

ChipletQuake: On-die Digital Impedance Sensing for Chiplet and Interposer Verification
por: Monfared, Saleh Khalaj, et al.
Publicado: (2025)

Designing High-Performance and Thermally Feasible Multi-Chiplet Architectures enabled by Non-bendable Glass Interposer
por: Sharma, Harsh, et al.
Publicado: (2025)

Toward Open-Source Chiplets for HPC and AI: Occamy and Beyond
por: Scheffler, Paul, et al.
Publicado: (2025)

Hecaton: Training Large Language Models with Scalable Chiplet Systems
por: Huang, Zongle, et al.
Publicado: (2024)

Monad: Towards Cost-effective Specialization for Chiplet-based Spatial Accelerators
por: Hao, Xiaochen, et al.
Publicado: (2023)

Designing Reconfigurable Interconnection Network of Heterogeneous Chiplets Using Kalman Filter
por: Biglari, Siamak, et al.
Publicado: (2024)

Educating for Hardware Specialization in the Chiplet Era: A Path for the HPC Community
por: Yoshii, Kazutomo, et al.
Publicado: (2024)

Challenges and Opportunities to Enable Large-Scale Computing via Heterogeneous Chiplets
por: Yang, Zhuoping, et al.
Publicado: (2023)

ChipletPart: Cost-Aware Partitioning for 2.5D Systems
por: Graening, Alexander, et al.
Publicado: (2025)

Automated Multi-Agent Workflows for RTL Design
por: Bhattaram, Amulya, et al.
Publicado: (2025)

ECO-CHIP: Estimation of Carbon Footprint of Chiplet-based Architectures for Sustainable VLSI
por: Sudarshan, Chetan Choppali, et al.
Publicado: (2023)

Tiny Chiplets Enabled by Packaging Scaling: Opportunities in ESD Protection and Signal Integrity
por: Haque, Emad, et al.
Publicado: (2025)

LEXI: Lossless Exponent Coding for Efficient Inter-Chiplet Communication in Hybrid LLMs
por: Sun, Miao, et al.
Publicado: (2026)

CHIPSIM: A Co-Simulation Framework for Deep Learning on Chiplet-Based Systems
por: Pfromm, Lukas, et al.
Publicado: (2025)

Chiplet Cloud: Building AI Supercomputers for Serving Large Generative Language Models
por: Peng, Huwan, et al.
Publicado: (2023)

RLPlanner: Reinforcement Learning based Floorplanning for Chiplets with Fast Thermal Analysis
por: Duan, Yuanyuan, et al.
Publicado: (2023)

Spec2RTL-Agent: Automated Hardware Code Generation from Complex Specifications Using LLM Agent Systems
por: Yu, Zhongzhi, et al.
Publicado: (2025)

Hemlet: A Heterogeneous Compute-in-Memory Chiplet Architecture for Vision Transformers with Group-Level Parallelism
por: Wang, Cong, et al.
Publicado: (2025)

Mozart: Modularized and Efficient MoE Training on 3.5D Wafer-Scale Chiplet Architectures
por: Luo, Shuqing, et al.
Publicado: (2026)

Mozart: A Chiplet Ecosystem-Accelerator Codesign Framework for Composable Bespoke Application Specific Integrated Circuits
por: Jin, Haoran, et al.
Publicado: (2025)