Cita APA (7a ed.)

Ghosh, K., Shrimali, B., & Jeong, S. (2026). Wafer-to-Wafer Bonding: Part: I -- The Coupled Physics Problem and the 2D Finite Element Implementation.

Cita Chicago Style (17a ed.)

Ghosh, Kamalendu, Bhavesh Shrimali, y Subin Jeong. Wafer-to-Wafer Bonding: Part: I -- The Coupled Physics Problem and the 2D Finite Element Implementation. 2026.

Cita MLA (9a ed.)

Ghosh, Kamalendu, et al. Wafer-to-Wafer Bonding: Part: I -- The Coupled Physics Problem and the 2D Finite Element Implementation. 2026.