Copertina

Wafer-to-Wafer Bonding: Part: I -- The Coupled Physics Problem and the 2D Finite Element Implementation

Fuente: arXiv

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Dettagli Bibliografici
Autori principali:	Ghosh, Kamalendu, Shrimali, Bhavesh, Jeong, Subin
Natura:	Preprint
Pubblicazione:	2026
Soggetti:	Computational Physics Applied Physics Fluid Dynamics
Accesso online:	Acceder al recurso
Tags:	Aggiungi Tag Nessun Tag, puoi essere il primo ad aggiungerne!!

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