Copertina

A Review of Multiscale Thermal Modeling in Heterogeneous 3D ICs

Fuente: arXiv

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Dettagli Bibliografici
Autori principali:	Barua, Baibhari Priya, Udoy, Md Rahatul Islam, Aziz, Ahmedullah
Natura:	Preprint
Pubblicazione:	2026
Soggetti:	Hardware Architecture
Accesso online:	Acceder al recurso
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