Computing In Spintronic Memory: A Thermal Perspective
Fuente:
arXiv
Salvato in:
| Autori principali: | , , , |
|---|---|
| Natura: | Preprint |
| Pubblicazione: |
2026
|
| Soggetti: | |
| Accesso online: | |
| Tags: |
Aggiungi Tag
Nessun Tag, puoi essere il primo ad aggiungerne!!
|
| _version_ | 1866914457349783552 |
|---|---|
| author | Miller, Patrick Cilasun, Hüsrev Sapatnekar, Sachin S. Karpuzcu, Ulya R. |
| author_facet | Miller, Patrick Cilasun, Hüsrev Sapatnekar, Sachin S. Karpuzcu, Ulya R. |
| contents | Computing-in-Memory (CiM) is a promising paradigm to address the memory bottleneck constraining traditional systems. Most power-efficient CiM variants can directly perform Boolean operations in non-volatile memory arrays. Higher microarchitectural activity due to CiM, however, can significantly increase power density (power per area) and result in thermal hotspots. In this paper, we provide a quantitative thermal characterization for CiM. We demonstrate that (i) the temperature remains mostly uniform due to lateral thermal conduction; (ii) the temperature increases linearly with the number of memory cells participating in computation; (iii) the temperature decreases linearly with the memory array size; (iv) the memory technology dictates the power density, hence the thermal characteristics. |
| format | Preprint |
| id |
arxiv_https___arxiv_org_abs_2604_06667 |
| institution | arXiv |
| publishDate | 2026 |
| record_format | arxiv |
| spellingShingle | Computing In Spintronic Memory: A Thermal Perspective Miller, Patrick Cilasun, Hüsrev Sapatnekar, Sachin S. Karpuzcu, Ulya R. Emerging Technologies Computing-in-Memory (CiM) is a promising paradigm to address the memory bottleneck constraining traditional systems. Most power-efficient CiM variants can directly perform Boolean operations in non-volatile memory arrays. Higher microarchitectural activity due to CiM, however, can significantly increase power density (power per area) and result in thermal hotspots. In this paper, we provide a quantitative thermal characterization for CiM. We demonstrate that (i) the temperature remains mostly uniform due to lateral thermal conduction; (ii) the temperature increases linearly with the number of memory cells participating in computation; (iii) the temperature decreases linearly with the memory array size; (iv) the memory technology dictates the power density, hence the thermal characteristics. |
| title | Computing In Spintronic Memory: A Thermal Perspective |
| topic | Emerging Technologies |
| url | https://arxiv.org/abs/2604.06667 |