EMSpice 3: Full-chip Temperature-Aware Multiphysics Electromigration and IR-Drop Analysis

Fuente: arXiv

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Bibliographic Details
Main Authors:	Lu, Haotian, Tan, Sheldon X. -D.
Format:	Preprint
Published:	2026
Subjects:	Hardware Architecture
Online Access:	Acceder al recurso
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Internet

https://arxiv.org/abs/2604.10743