Hybrid functional calculation of electrical activity and complexing mechanism of Cu-related defects

Fuente: arXiv
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Main Authors: Shi, Xinyu, He, Zirui, Sun, An-An, Shen, Siqing, Liang, Yongli, Hu, Hao, Gao, Shang-Peng, Chen, Meng
Format: Preprint
Published: 2026
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author Shi, Xinyu
He, Zirui
Sun, An-An
Shen, Siqing
Liang, Yongli
Hu, Hao
Gao, Shang-Peng
Chen, Meng
author_facet Shi, Xinyu
He, Zirui
Sun, An-An
Shen, Siqing
Liang, Yongli
Hu, Hao
Gao, Shang-Peng
Chen, Meng
contents Copper is a detrimental impurity in silicon with high diffusivity and a high tendency to precipitate. Interaction between Cu and other defects is essential for understanding the nature of Cu precipitation in silicon. Despite extensive experimental investigations of Cu-related defects in silicon, a comprehensive understanding remains elusive due to limitations of techniques in resolving defect configurations, as well as inconsistencies between theoretical and experimental results regarding transition levels. Moreover, the underlying formation mechanism of the well-known $\mathrm{Cu_{PL}}$ line is still unclear. In this work, configurations, formation energies, and transition levels of Cu-related defects in silicon are calculated using the HSE06 functional and finite-size correction. Defects involved in this study include $\mathrm{Cu_i}$, $\mathrm{Cu_{Si}}$, Cu-B, Cu-P, and Cu-H. A $\mathrm{Cu_{i4}V}$ model is proposed to explain the discrepancies between theory and experiment about $\mathrm{Cu_{PL}}$ defect. Our calculations may provide insight into the electrically active defects and the early states of Cu precipitation in silicon.
format Preprint
id arxiv_https___arxiv_org_abs_2604_11675
institution arXiv
publishDate 2026
record_format arxiv
spellingShingle Hybrid functional calculation of electrical activity and complexing mechanism of Cu-related defects
Shi, Xinyu
He, Zirui
Sun, An-An
Shen, Siqing
Liang, Yongli
Hu, Hao
Gao, Shang-Peng
Chen, Meng
Materials Science
Copper is a detrimental impurity in silicon with high diffusivity and a high tendency to precipitate. Interaction between Cu and other defects is essential for understanding the nature of Cu precipitation in silicon. Despite extensive experimental investigations of Cu-related defects in silicon, a comprehensive understanding remains elusive due to limitations of techniques in resolving defect configurations, as well as inconsistencies between theoretical and experimental results regarding transition levels. Moreover, the underlying formation mechanism of the well-known $\mathrm{Cu_{PL}}$ line is still unclear. In this work, configurations, formation energies, and transition levels of Cu-related defects in silicon are calculated using the HSE06 functional and finite-size correction. Defects involved in this study include $\mathrm{Cu_i}$, $\mathrm{Cu_{Si}}$, Cu-B, Cu-P, and Cu-H. A $\mathrm{Cu_{i4}V}$ model is proposed to explain the discrepancies between theory and experiment about $\mathrm{Cu_{PL}}$ defect. Our calculations may provide insight into the electrically active defects and the early states of Cu precipitation in silicon.
title Hybrid functional calculation of electrical activity and complexing mechanism of Cu-related defects
topic Materials Science
url https://arxiv.org/abs/2604.11675