Building reliable 3D photonic integrated circuits and cavities at the wafer scale

Fuente: arXiv
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Bibliographic Details
Main Authors: Huang, Yuhao, Fu, Yunqi, Xia, Yu, Li, Yuemin, Li, Zheng, Huang, Yaoran, Geng, Zhaoting, Liu, Mingfei, Xiang, Chao
Format: Preprint
Published: 2026
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