Building reliable 3D photonic integrated circuits and cavities at the wafer scale
Fuente:
arXiv
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| Main Authors: | Huang, Yuhao, Fu, Yunqi, Xia, Yu, Li, Yuemin, Li, Zheng, Huang, Yaoran, Geng, Zhaoting, Liu, Mingfei, Xiang, Chao |
|---|---|
| Format: | Preprint |
| Published: |
2026
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| Subjects: | |
| Online Access: | |
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