Transient Multiscale Workflow for Thermal Analysis of 3DHI Chip Stack

Fuente: arXiv

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Bibliographic Details
Main Authors:	Elahi, Mohammad, Bloomfield, Max O., Borca-Tasciuc, Theodorian, Merson, Jacob S.
Format:	Preprint
Published:	2026
Subjects:	Computational Engineering, Finance, and Science
Online Access:	Acceder al recurso
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Internet

https://arxiv.org/abs/2605.00399