Photolithography-Only Fabrication of Transmons Using Double-Oblique Evaporation

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Hauptverfasser: Aoyanagi, K., Abe, S., Chen, S., Inada, T., Kawai, C., Mino, Y., Nakamura, K., Nakazono, K., Nitta, T., Watanabe, K.
Format: Preprint
Veröffentlicht: 2026
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author Aoyanagi, K.
Abe, S.
Chen, S.
Inada, T.
Kawai, C.
Mino, Y.
Nakamura, K.
Nakazono, K.
Nitta, T.
Watanabe, K.
author_facet Aoyanagi, K.
Abe, S.
Chen, S.
Inada, T.
Kawai, C.
Mino, Y.
Nakamura, K.
Nakazono, K.
Nitta, T.
Watanabe, K.
contents We investigate a photolithography-only fabrication process for transmon Josephson junctions using a modified double-oblique evaporation geometry. Using a bilayer resist process and Al shadow evaporation, we fabricate junction structures and confirm by optical and scanning electron microscopy that the resulting narrowed crossing region reaches a geometrical area on the order of $10^4~\mathrm{nm}^2$, which lies in the size range relevant to qubit junction fabrication. Room-temperature resistance screening shows that the junction resistance falls within the target range for the present transmon design over a usable process window and exhibits a clear design dependence. We further implement fabricated junctions in transmon devices and evaluate them in a three-dimensional Al cavity at $20 \, \mathrm{mK}$, where we observe basic transmon qubit operation with $f_{01}$=4.865 GHz, $T_1 \sim 9 \, μ\mathrm{s}$, and $T_2^* \sim 0.4 \, μ\mathrm{s}$. These results demonstrate the feasibility of realizing functional transmon devices in a photolithography-only process using double-oblique evaporation.
format Preprint
id arxiv_https___arxiv_org_abs_2605_19590
institution arXiv
publishDate 2026
record_format arxiv
spellingShingle Photolithography-Only Fabrication of Transmons Using Double-Oblique Evaporation
Aoyanagi, K.
Abe, S.
Chen, S.
Inada, T.
Kawai, C.
Mino, Y.
Nakamura, K.
Nakazono, K.
Nitta, T.
Watanabe, K.
Quantum Physics
Applied Physics
We investigate a photolithography-only fabrication process for transmon Josephson junctions using a modified double-oblique evaporation geometry. Using a bilayer resist process and Al shadow evaporation, we fabricate junction structures and confirm by optical and scanning electron microscopy that the resulting narrowed crossing region reaches a geometrical area on the order of $10^4~\mathrm{nm}^2$, which lies in the size range relevant to qubit junction fabrication. Room-temperature resistance screening shows that the junction resistance falls within the target range for the present transmon design over a usable process window and exhibits a clear design dependence. We further implement fabricated junctions in transmon devices and evaluate them in a three-dimensional Al cavity at $20 \, \mathrm{mK}$, where we observe basic transmon qubit operation with $f_{01}$=4.865 GHz, $T_1 \sim 9 \, μ\mathrm{s}$, and $T_2^* \sim 0.4 \, μ\mathrm{s}$. These results demonstrate the feasibility of realizing functional transmon devices in a photolithography-only process using double-oblique evaporation.
title Photolithography-Only Fabrication of Transmons Using Double-Oblique Evaporation
topic Quantum Physics
Applied Physics
url https://arxiv.org/abs/2605.19590