3D Photonic integration leveraging hybrid-confinement circuits
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arXiv
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| Autores principales: | , , , |
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| Formato: | Preprint |
| Publicado: |
2026
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| _version_ | 1866911714104049664 |
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| author | Sharma, Kanhaya Grabulosa, Adrià Jung, Erik Brunner, Daniel |
| author_facet | Sharma, Kanhaya Grabulosa, Adrià Jung, Erik Brunner, Daniel |
| contents | Three-dimensional (3D) photonic integration offers a pathway to overcome the fundamental scaling limitations of planar platforms by enabling enhanced routing flexibility for compact, low-loss, and highly interconnected photonic circuits. In this work, we fabricate 3D photonic circuits combining high-confinement air-clad waveguides for compact routing with low-confinement polymer-clad waveguides for robust single-mode operation within a monolithic platform. Efficient mode transition between polymer-clad and air-clad waveguides is demonstrated with a loss of 0.25 dB per interface. We also realize compact, Euler S- and U-shaped bends with minimal bending radii of 10 $μ$m and losses as low as 0.5 dB and 0.4 dB, respectively, along with compact adiabatic air-clad splitters exhibiting a splitting loss of 0.6~dB over a length of 52 $μ$m. Finally, full fabrication of a compact hybrid circuit is demonstrated, highlighting the feasibility and scalability of the approach. Our work represents a significant step in 3D photonic integration for applications including optical neural networks, photonic wire bonding and their potential for novel integrated photonic applications. |
| format | Preprint |
| id |
arxiv_https___arxiv_org_abs_2605_24990 |
| institution | arXiv |
| publishDate | 2026 |
| record_format | arxiv |
| spellingShingle | 3D Photonic integration leveraging hybrid-confinement circuits Sharma, Kanhaya Grabulosa, Adrià Jung, Erik Brunner, Daniel Optics Three-dimensional (3D) photonic integration offers a pathway to overcome the fundamental scaling limitations of planar platforms by enabling enhanced routing flexibility for compact, low-loss, and highly interconnected photonic circuits. In this work, we fabricate 3D photonic circuits combining high-confinement air-clad waveguides for compact routing with low-confinement polymer-clad waveguides for robust single-mode operation within a monolithic platform. Efficient mode transition between polymer-clad and air-clad waveguides is demonstrated with a loss of 0.25 dB per interface. We also realize compact, Euler S- and U-shaped bends with minimal bending radii of 10 $μ$m and losses as low as 0.5 dB and 0.4 dB, respectively, along with compact adiabatic air-clad splitters exhibiting a splitting loss of 0.6~dB over a length of 52 $μ$m. Finally, full fabrication of a compact hybrid circuit is demonstrated, highlighting the feasibility and scalability of the approach. Our work represents a significant step in 3D photonic integration for applications including optical neural networks, photonic wire bonding and their potential for novel integrated photonic applications. |
| title | 3D Photonic integration leveraging hybrid-confinement circuits |
| topic | Optics |
| url | https://arxiv.org/abs/2605.24990 |