Decoupling heat and electricity: A thermal invisible gateway
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arXiv
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| Auteurs principaux: | , , , , , , |
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| Format: | Preprint |
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2026
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| _version_ | 1866914615364943872 |
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| author | Li, Jiahao Sun, Fei Liu, Yichao Qi, Yawen Liao, Qin Yang, Jianpu Xie, Zhiru |
| author_facet | Li, Jiahao Sun, Fei Liu, Yichao Qi, Yawen Liao, Qin Yang, Jianpu Xie, Zhiru |
| contents | The Wiedemann-Franz law couples electrical and thermal conductivity, making high electrical conduction with low thermal conduction a major challenge. To overcome this, we designed an active thermal metasurface (ATMS) - based thermal invisible gateway that decouples thermal and electrical paths. Built on a copper substrate with a dumbbell-shaped bridge, the structure suppresses heat flow via directional compensation while allowing unimpeded electrical conduction. Room-temperature experiments show an effective thermal conductivity below 10^-3 W m^-1 K^-1 (near zero, air-like insulation) and an electrical conductivity up to 2.8x10^7 S m^-1 (metal-level). Unlike conventional material-modification approaches, our work uses macroscopic structural design to break the intrinsic coupling, offering a promising solution for applications like on-chip interconnects and wearable electronics. |
| format | Preprint |
| id |
arxiv_https___arxiv_org_abs_2605_29699 |
| institution | arXiv |
| publishDate | 2026 |
| record_format | arxiv |
| spellingShingle | Decoupling heat and electricity: A thermal invisible gateway Li, Jiahao Sun, Fei Liu, Yichao Qi, Yawen Liao, Qin Yang, Jianpu Xie, Zhiru Applied Physics The Wiedemann-Franz law couples electrical and thermal conductivity, making high electrical conduction with low thermal conduction a major challenge. To overcome this, we designed an active thermal metasurface (ATMS) - based thermal invisible gateway that decouples thermal and electrical paths. Built on a copper substrate with a dumbbell-shaped bridge, the structure suppresses heat flow via directional compensation while allowing unimpeded electrical conduction. Room-temperature experiments show an effective thermal conductivity below 10^-3 W m^-1 K^-1 (near zero, air-like insulation) and an electrical conductivity up to 2.8x10^7 S m^-1 (metal-level). Unlike conventional material-modification approaches, our work uses macroscopic structural design to break the intrinsic coupling, offering a promising solution for applications like on-chip interconnects and wearable electronics. |
| title | Decoupling heat and electricity: A thermal invisible gateway |
| topic | Applied Physics |
| url | https://arxiv.org/abs/2605.29699 |