Bending-like stress induced by solder joint under uniaxial tensile testing in 2G-HTS tapes: Impact and optimization approach

Fuente: arXiv

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Bibliographic Details
Main Authors:	Liu, Dean, Wu, Yue, Xiang, Haoliang, Li, Xiaofen, Fu, Caida, Dong, Chiheng, Zhao, Yue
Format:	Preprint
Published:	2026
Subjects:	Superconductivity
Online Access:	Acceder al recurso
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Internet

https://arxiv.org/abs/2605.30760