Interconnection between microstructure and microhardness of directionally solidified binary Al-6wt.%Cu and multicomponent Al-6wt.%Cu-8wt.%Si alloys
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Redalyc
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| Auteur principal: | ANGELA J. VASCONCELOS |
|---|---|
| Format: | Artículo científico |
| Langue: | en |
| Publié: |
Academia Brasileira de Ciências
2016
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